Engineering Case Studies
From sub-micron semiconductor packaging to life-saving medical devices. Explore how we solve complex engineering challenges.
Semiconductor & Optomechanics
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Semiconductor Integration for AI Applications
Challenge
Enabling the manufacturing of next-generation chips required for high-performance Artificial Intelligence (AI) computing.
Microfluidic Packaging for Semiconductor Devices
Challenge
Aligning and bonding microfluidic manifolds to semiconductor chips with hundreds of I/O points without leakage or misalignment.
High-Precision Laser Diode Integration
Challenge
Integrating light sources directly onto semiconductor chips to eliminate the need for bulky off-chip optical excitation…
Microfluidic Packaging for Semiconductor Devices
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Semiconductor Integration for AI Applications
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Medical Devices & Biotechnology
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Industrial
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
High-Precision Laser Diode Integration
Challenge
Integrating light sources directly onto semiconductor chips to eliminate the need for bulky off-chip optical excitation. The…
Microfluidic Packaging for Semiconductor Devices
Challenge
Aligning and bonding microfluidic manifolds to semiconductor
chips with hundreds of I/O points without leakage or misalignment.
Semiconductor Integration for AI Applications
Challenge
Enabling the manufacturing of next-generation chips required for high-performance Artificial Intelligence (AI) computing.
Different styles
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
High-Precision Laser Diode Integration
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
Integrated Photonic Chip Design
Challenge
Integrating light sources directly onto semiconductor chips to eliminate the need for bulky off-chip optical excitation. The…
Semiconductor Integration for AI Applications
Challenge
Enabling the manufacturing of next-generation chips required for high-performance Artificial Intelligence (AI) computing.
Integrated Photonic Chip Design
Challenge
Developing a next-generation integrated circuit combining multiple physical domains on a single footprint.
IDEAS
Let's Build Something Extraordinary Together!
Have a project in mind? Whether you need a feasibility study, a functional prototype, or a full-scale design for manufacturing, Lysitron is ready to help.
- Feasibility Studies & Consulting
- Functional Prototyping
- Design for Manufacturing